Дополнительное описание
Highlights of LBP3800
High capability and large capacity
Modular stack design, support TD-LTE/LTE FDD. Support TD-LTE 3*20M / LTE FDD 3*20M.
Highly integrated
Adopt a highly integrated baseband SOC chip. Integrate 6 DSP processing cores and physical layer hardware accelerators and 4 PowerPC processing cores and network accelerators.
Standard interface
Standard PCIe interface, convenient for customer integration.